SAMSUNG GALAXY J1 MINI PRIME J106H DUMP FILE RESET FRP ISP PIN OUT DEAD BOOT REPAIR - World Mobile KPR

Wednesday, January 13, 2021

SAMSUNG GALAXY J1 MINI PRIME J106H DUMP FILE RESET FRP ISP PIN OUT DEAD BOOT REPAIR

SAMSUNG GALAXY J1 MINI PRIME J106H 


                                                                           ISP PIN OUT



                                                  READ FIRST INFO IDENTIFY EMMC

Connection status: EHCI:HUB[#2]:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number:
 Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
 Card/BGA: BGA (Discrete embedded) - High density MMC
 Manufacturer ID: 0x90 (SK Hynix)
 Product name: H8G4t (0x483847347492), rev: 0x01, serial number: 0x28C09DE5
 Manufacturing date: Jun 2017
CID: 90014A48 38473474 920128C0 9DE5640A
CSD: D0270132 0F5903FF FFFFFFE7 8A40002A
EXT_CSD revision: 1.7 (MMC v5.0, v5.01) 
Partition info:
 Boot1: 4 MiB
 Boot2: 4 MiB
 RPMB: 4 MiB [Authentication Key not yet programmed]
 User area: 7.28 GiB(7,818,182,656 bytes)
Cache size: 1 MiB
Partition configuration: 0x08
 No boot acknowledge is sent (default)
 Boot partition 1 is enabled for boot
Partitioning support: 0x07
 Device support partitioning feature
 Device can have enhanced technological features
 Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00

ANDROID System Info:
 platform: sc8830, cpu abi: armeabi-v7a
 manufacturer: samsung
 board: SC7727SE, name: j1minive3gjv
 brand: samsung, model: SM-J106H
 build model list: SM-J106H
 build id: MMB29Q, version: 6.0.1 [Marshmallow] (MMB29Q.J106HJVU0ARJ1)
 build description: j1minive3gjv-user 6.0.1 MMB29Q J106HJVU0ARJ1 release-keys

Internal storage: 4.22 GiB
crypto state: unencrypted
EXT_CSD backup saved to "\\%BACKUPS%\H8G4t_28C09DE5.ext_csd"

READ BACKUP DUMP FILE


Connection status: EHCI:HUB[#2]:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number:
 Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 24MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
 Card/BGA: BGA (Discrete embedded) - High density MMC
 Manufacturer ID: 0x90 (SK Hynix)
 Product name: H8G4t (0x483847347492), rev: 0x01, serial number: 0x28C09DE5
 Manufacturing date: Jun 2017
CID: 90014A48 38473474 920128C0 9DE5640A
CSD: D0270132 0F5903FF FFFFFFE7 8A40002A
EXT_CSD revision: 1.7 (MMC v5.0, v5.01) 
Partition info:
 Boot1: 4 MiB
 Boot2: 4 MiB
 RPMB: 4 MiB [Authentication Key not yet programmed]
 User area: 7.28 GiB(7,818,182,656 bytes)

Reading extcsd, size: 512 bytes...
File saved to "\\%BACKUPS%\samsung\SM-J106H(MMB29Q.J106HJVU0ARJ1-6.0.1-MMB29Q)[H8G4t_28C09DE5]\ext_csd.bin" (CRC32: 0xDB3104D8) 
Current partition access: 
 Access to boot partition 1
Reading boot1, size: 4 MiB... Done in 1.734 s
File saved to "\\%BACKUPS%\samsung\SM-J106H(MMB29Q.J106HJVU0ARJ1-6.0.1-MMB29Q)[H8G4t_28C09DE5]\boot1.bin" (CRC32: 0x500082AE) 
 Blank checking: NOT blank
Current partition access: 
 Access to boot partition 2
Reading boot2, size: 4 MiB... Done in 1.773 s
File saved to "\\%BACKUPS%\samsung\SM-J106H(MMB29Q.J106HJVU0ARJ1-6.0.1-MMB29Q)[H8G4t_28C09DE5]\boot2.bin" (CRC32: 0x1147406A) 
 Blank checking: NOT blank
Current partition access: 
 Access to user area
Reading userarea, size: 128 MiB...  Done in 1 min 1.390 s
File saved to "\\%BACKUPS%\samsung\SM-J106H(MMB29Q.J106HJVU0ARJ1-6.0.1-MMB29Q)[H8G4t_28C09DE5]\userarea_128MiB.bin" (CRC32: 0xC4C193D4) 
 Blank checking: NOT blank

 RESET FRP LOCK


Connection status: EHCI:HUB[#2]:USB 2.00 High-Speed

Interface: UFI High-Speed

Serial number: 

 Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)

Insertion test... Done

Init bus...

VCC: 3.3 V, VCCQ: 1.8 V

Bus: 1 bit (SDR 4MHz)

Access mode: sector mode

Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)

 Card/BGA: BGA (Discrete embedded) - High density MMC

 Manufacturer ID: 0x90 (SK Hynix)

 Product name: H8G4t (0x483847347492), rev: 0x01, serial number: 0x28C09DE5

 Manufacturing date: Jun 2017

CID: 90014A48 38473474 920128C0 9DE5640A

CSD: D0270132 0F5903FF FFFFFFE7 8A40002A

EXT_CSD revision: 1.7 (MMC v5.0, v5.01) 

Partition info:

 Boot1: 4 MiB

 Boot2: 4 MiB

 RPMB: 4 MiB [Authentication Key not yet programmed]

 User area: 7.28 GiB(7,818,182,656 bytes)


Clear FRP Lock... Done

download dump file for dead boot repair

                                                                 DOWNLOAD

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