Samsung Galaxy J7 Prime G610f
ISP PINOUT
Connection status: EHCI:HUB[#2]:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-6385
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 24MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: AJNB3R (0x414a4e423352), rev: 0x03, serial number: 0xF05BEA9B
Manufacturing date: Sep 2016
CID: 15010041 4A4E4233 5203F05B EA9B939E
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 4 MiB [Provisioned, counter: 2]
User area: 14.68 GiB(15,758,000,128 bytes)
Cache size: 64 MiB
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x01
Bus width: x4 (sdr/ddr), boot mode: sdr(default), reset bus width to x1 sdr(default)
Boot area write protection: 0x00
User area write protection: 0x10
Password protection features: enabled
Power-on write protection: possible
Permanent write protection: not possible
Lock status: not locked
ANDROID System Info:
platform: exynos5, cpu abi: armeabi-v7a
manufacturer: samsung
board: universal7870, name: on7xeltedd
brand: samsung, model: SM-G610F
build model list: SM-G610F
build id: M1AJQ, version: 8.1.0 [Oreo] (M1AJQ.G610FDDU1CRJ4)
build description: on7xeltedd-user 8.1.0 M1AJQ G610FDDU1CRJ4 release-keys
crypto state: encrypted?
Detected: SAMSUNG moviNAND KMAJN000B3-RXXX/16G
Connection status: EHCI:HUB[#2]:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-6385
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 24MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: AJNB3R (0x414a4e423352), rev: 0x03, serial number: 0xF05BEA9B
Manufacturing date: Sep 2016
CID: 15010041 4A4E4233 5203F05B EA9B939E
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 4 MiB [Provisioned, counter: 2]
User area: 14.68 GiB(15,758,000,128 bytes)
Current partition access:
Access to boot partition 1
Reading boot1, size: 4 MiB... Done in 0.558 s
File saved to "\\%BACKUPS%\samsung\SM-G610F(M1AJQ.G610FDDU1CRJ4-8.1.0-M1AJQ)[AJNB3R_F05BEA9B]\boot1.bin" (CRC32: 0x579036D0)
Blank checking: NOT blank
Current partition access:
Access to boot partition 2
Reading boot2, size: 4 MiB... Done in 0.542 s
File saved to "\\%BACKUPS%\samsung\SM-G610F(M1AJQ.G610FDDU1CRJ4-8.1.0-M1AJQ)[AJNB3R_F05BEA9B]\boot2.bin" (CRC32: 0x9C522C95)
Blank checking: NOT blank
Current partition access:
Access to user area
Reading userarea, size: 128 MiB... Done in 20.785 s
File saved to "\\%BACKUPS%\samsung\SM-G610F(M1AJQ.G610FDDU1CRJ4-8.1.0-M1AJQ)[AJNB3R_F05BEA9B]\userarea_128MiB.bin" (CRC32: 0x052C8AA3)
Blank checking: NOT blank
download dump file
this information only dump file
for boot repair goto factory image tab
select samsung
now put drug and drop
pit+bl file and write
now your phone show donload mode
open odin and flash 4file firmware.
doqnload dump file
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